Electric induction soldering process of finned tube and its application 翅片管电感应钎焊工艺及其应用
This article introduce the flow chart of technology and their different characteristic in the installation and wiring of electric equipment PCB mixed pin-through-hole and SMD, expound the principle and the design of technical parameters of Pin-through-hole Reflow Soldering Technology. 本文介绍了混装印制板装联技术的工艺流程和各自特点,并着重介绍了穿孔再流焊技术的原理和工艺参数设计。
The microstructural stability of the solders which acts as the thermal, electric and mechanical connections, directly affects the soldering performance during microelectronic packing process. 微电子封装工艺中,起到热、电和机械连接作用的无铅焊料其组织结构的稳定性将直接影响着焊点的连接性能。